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FR4 OSP Surface Multilayer Printed Circuit Board 4 Layer PCB Board OEM/ODM Service

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Dongguan Xingqiang Circuit Board Technology Co., Ltd.

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FR4 OSP Surface Multilayer Printed Circuit Board 4 Layer PCB Board OEM/ODM Service

Name: FR4 OSP Surface Multilayer Printed Circuit Board 4 Layer PCB Board OEMODM Service
Brand: xingqiang
Price: 1 USD

Brand Name : xingqiang

Model Number : Varies by goods condition

Certification : ROHS, CE

Place of Origin : China

MOQ : Sample,1 pc(5 square meters)

Price : NA

Payment Terms : ,T/T,Western Union

Supply Ability : 100000㎡/Month

Delivery Time : 12-15 work days

Product : Print Circuit Board

Max.Board Size : 528*600mm

Minimum Line Space : 3mil (0.075mm)

Surface Finishing : HASL/OSP/ENIG

Material : FR4

Pcba Standard : IPC-A-610 E Class II-III

Production : Gerber Files or BOM List

Board Thinkness : 1.6/1.2/1.0/0.8 or Customized

Layer Counts : 2/4/6/8/10L or Customizable

Ink Color : Green/Red/Yellow/White/Black/Blue

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FR4 OSP Surface Finishing Process

A Multilayer Printed Circuit Board (PCB) is a sophisticated assembly consisting of three or more conductive copper layers laminated together under high pressure and heat, with insulating materials (such as core and prepreg) separating each layer. Unlike single-sided boards, this complex structure enables high-density wiring and superior signal integrity.

Main Advantages of Multilayer PCB:

1. Enhanced Signal Integrity	• Separates signal layers from power/ground layers, reducing crosstalk between adjacent signal traces. • Provides a dedicated reference plane (ground or power) for signal layers, minimizing signal reflection and transmission loss.
2. Higher Component Density & Space Savings	• Allows routing of traces on four layers instead of two, enabling more complex circuit designs in a smaller board area. • Reduces the need for through-hole vias or jumper wires, making the board layout more compact and suitable for miniaturized devices.
3. Improved Electromagnetic Compatibility (EMC)	• Dedicated power and ground layers form a stable "power-ground plane capacitor," filtering out high-frequency noise. • Isolates sensitive analog signals from noisy digital circuits by placing them on separate layers, reducing electromagnetic interference (EMI) emissions and susceptibility.
4. Cost-Effectiveness for Complex Designs	• More economical than 6-layer or higher-layer PCBs when basic 2-layer boards cannot meet performance requirements. • Lowers overall system costs by reducing the need for additional external components (e.g., noise filters) that compensate for poor signal or EMC performance.

How to order multi-layer boards?

Send us your customizable Files:
1. Gerber files (RS-274X)
2. BOM (if PCBA needed)
3. Impedance requirements & stack-up (if available)
4.Test requirements (TDR, network analyzer, etc.)

Tip:Normally,Gerber files includes: PCB type,thickness, ink color, surface treatment process, and if SMT processing is required, you can provide a component BOM and reference designation diagram, etc.

We’ll reply within 24 hours with a free quote, DFM report, and material recommendation.

FR4 OSP Surface Multilayer Printed Circuit Board 4 Layer PCB Board OEM/ODM Service

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FR4 OSP Surface Multilayer Printed Circuit Board 4 Layer PCB Board OEM/ODM Service

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FR4 OSP Surface Multilayer Printed Circuit Board 4 Layer PCB Board OEM/ODM Service

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FR4 OSP Surface Multilayer Printed Circuit Board 4 Layer PCB Board OEM/ODM Service

Product Tags:

OSP Surface Multilayer Printed Circuit Board

FR4 Material 4 Layer PCB Board

FR4 OSP Surface Multilayer Printed Circuit Board 4 Layer PCB Board OEM/ODM Service Images

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